Silver die-attach adhesive

One-part, aqueous, silver conductive adhesive for use as die-attach and gap filler material. The adhesive is suitable for bonding dissimilar metals. Its gel consistency ensures physical stability and prevents run-off after dispensing. This product is specifically designed for low-temperature cure. For best results, pressure must be applied during cure.

Silver content: 53%

Application methods: manual dispensing, pneumatic ink dispensing, micro-extrusion, bar coating, brush.

Key substrates: metal (copper, aluminium, nickel), printed conductive tracks.

Cure temperature: any temperature between 50 and 200 °C.

Sheet resistance: 9 mOhms/sq at 25µm thickness when cured at 200 °C.

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